PanelMate Is Not Panel-Mount, and the Family Is Already Being Withdrawn
Two Molex families share 1.25mm, 125V and 1.0A — and the one called PanelMate mounts to the PCB, not to the chassis.
Two facts decide whether a "Molex MX1.25 PanelMate" project succeeds, and neither is an electrical rating.
The first is in the name, and the name is wrong. Molex's own part data for the 51146 receptacle housing records Panel Mount: No. "PanelMate" does not mean a connector that fastens through a chassis or enclosure panel. It means flat panel displays — Molex's series description says the connectors were designed for "Flat Panel Display Panels that require thin, low profile connectors" — and its product specification opens with the scope line "1.25mm Pitch Wire to Board SMT Connector", which tells you the board side is surface mount and the connector mounts to the PCB.
If your requirement is a bulkhead feed-through, neither the original part nor any cross-reference of it is the right part. The requirement that decides which family you need is the panel, not the pitch.
The second is that the original is being withdrawn on a published schedule. The 51146 housing is recorded as Not Recommended For New Design with 5055650501 as a replacement part number, the 53780 header is recorded as Obsolete under product change notification 516676 — issued 2025-03-10, with an implementation date of 2026-05-31 — and the 506418041 terminal is likewise NRND with 5054311100 as its replacement. That implementation date has passed.
Here is the full system: what PanelMate is, why its name misleads, why it and PicoBlade look identical on a datasheet and are not interchangeable, and the ten things to verify before you cross-reference it.
What the Molex PanelMate is
Molex positions the series as "the lowest profile of any fully-shrouded wire-to-board system from Molex", and sells it at three heights depending on which board-side header you select. Molex's specification for the family is PS-51146-010, scope: "1.25mm Pitch Wire to Board SMT Connector".
- Pitch: 1.25mm, single row
- Configuration: wire-to-board, surface mount on the board side
- Wire side: 51146 receptacle housing ("Ultra Low Profile")
- Board side: 53779 · 53780 · 55063 plug assemblies — SMT, right-angle, fully shrouded
- Crimp terminals: 50641 for AWG #28–30 · 50753 for AWG #30–32
- Voltage rating: 125V AC (RMS)/DC
- Current rating: 1.0A maximum per contact
- Applicable wire: AWG #28, #30, #32
- Insulation O.D.: φ0.9mm max at #28 and #30 · φ0.55mm max at #32 — a gauge-specific window
- Contact resistance: 20mΩ max initial · 5mΩ max on the crimped portion
- Insulation resistance: 100MΩ min at 500V DC
- Dielectric strength: 250V AC (RMS) for 1 minute, no breakdown
- Operating temperature: −40°C to +85°C, including terminal temperature rise
- Durability: 30 mating cycles (PS-51146-010) · 50 per molex.com part data for the 53780
- Temperature rise: 30°C max at rated current
- Profile height: 1.03mm (55063) · 1.3mm (53779) · 1.85mm (53780) — molex.com describes the 53780 as "1.90mm Height"
- Contact material: phosphor bronze
- Plating: gold 0.200µm min mating / 3.000µm min termination on the 53780 header · gold 0.203µm min on terminal
506418041 - Retention: friction lock — part data records Lock to Mating Part: No for the 53780 header, consistent with a friction-only interface
- Panel mount: No
- Standards: UL E29179 · CSA LR19980
- Mating cycles, circuit range: the 53780 part list enumerates 2, 3, 4, 5, 6, 7, 8, 9, 10, 14, 15 and 20 circuits
- Packaging: embossed tape on reel for the headers
- Cross-reference equivalent: KONNRA KR1253
Three design choices define the series, and they explain why it exists:
- Ultra-low profile, sold by height. The family is three plug assemblies at 1.03mm, 1.3mm and 1.85mm. Note that molex.com describes the 53780 as a 1.90mm part while the specification says 1.85mm — a document-versus-catalogue discrepancy that is normal on this family, and the reason a footprint check belongs in your drawing review rather than in a datasheet summary.
- An SMT header with real PCB retention. Both the specification and Molex's series description emphasise the solder tabs — "fitting nails" in the specification's own wording — and a solder-conducting fillet tail design. The series exists because a 1.25mm connector on a thin display board has almost no room for a retention feature, so the retention has to come from the solder interface itself.
- A crimped wire side with a friction lock, carried in the 51146 housing — the half that is withdrawn when the assembly is serviced.

What PanelMate actually is, if not a panel-mount part
Molex's product specification scope line answers this in one sentence: "1.25mm Pitch Wire to Board SMT Connector."
The series is a board-mounted, right-angle SMT header that sits flat against a display or main board, with a crimped wire harness plugging into it. KONNRA's own overview describes the KR1253 as designed "for flat panel displays with extra thin connectors", with SMT solder tails for PCB retention.
Why the distinction matters for a cross-reference — three consequences:
- If your design needs a bulkhead or chassis-panel feed-through, stop. Neither the original nor the replacement is the right part, and it is the panel requirement — not the pitch — that decides which family you should be looking at.
- If your design is a display board with a harness crossing the enclosure, PanelMate is exactly the intended product: the harness passes through the enclosure opening as a wire bundle, and the connector stays on the PCB. Nothing in Molex's documentation describes a PanelMate part that fixes to the enclosure itself.
- The retention load therefore lands on the solder tabs. Molex's specification requires that all terminal tails and fitting nails are soldered, and warns that leaving any soldering area open risks terminal drop-out, pin-to-pin short circuits, terminal buckling, or the connector coming off the PCB. On a display board with a harness hanging off it, this is the note that decides field reliability — and it is a requirement rather than a process preference.
Ask the question directly on the enquiry: "does your application require the connector to be fastened to an enclosure panel?" If the answer is yes, the requirement is a panel-mount connector, and the answer is not a PanelMate part number on either side.

PanelMate versus PicoBlade: identical on paper, not interchangeable
At 1.25mm, Molex sells more than one family, and this is where cross-references go wrong before any specification is compared.
- Molex PanelMate — wire side 51146, board side 53779 / 53780 / 55063, terminals 50641 / 50753 · wire-to-board only · blade-type pin, shell hooks, friction lock · sold at 1.03 / 1.3 / 1.85mm by plug assembly · up to 20 circuits in the published part list
- Molex PicoBlade — wire side 51021, board side 53048 · wire-to-board and wire-to-wire · two-point contact design · 2 to 15 circuits · not positioned as an ultra-low-profile system
Look at what agrees: the pitch (1.25mm), the voltage (125V), and the current (1.0A per contact — with PicoBlade dropping to 0.8A at AWG #32). A datasheet comparison of headline ratings says these two are the same connector.
They are not. The board-side footprints differ, the mating interfaces differ, the contact geometry differs, and the ultra-low-profile envelope that PanelMate exists to deliver is not reproduced by PicoBlade.
So what actually separates them? Not the electrical rating — the profile height requirement and the configuration. PanelMate is a specialist part specified for a vertical-clearance problem; PicoBlade is the mainstream 1.25mm workhorse that also covers wire-to-wire. If your design was released against a PanelMate part number, do not accept a PicoBlade cross-reference as equivalent, and vice versa.
The rule that prevents the whole class of error: at 1.25mm, confirm the Molex series number on the drawing before cross-referencing anything. Molex alone runs PanelMate (51146), PicoBlade (51021 / 53048) and Pico-EZmate at 1.20mm — and none of them mate with each other.
The withdrawal schedule is now the strongest reason to open the enquiry
Procurement asks a different question from engineering: not "will it work" but "is the supply chain around it safe". On this family, that question has a documented answer that does not depend on price:
- 51146 housing — Not Recommended For New Design, replacement part number 5055650501
- 53780 header — Obsolete, under product change notification 516676, issued 2025-03-10, implementation date 2026-05-31
- 506418041 terminal — Not Recommended For New Design, replacement part number 5054311100
That implementation date has passed. A connector family being withdrawn on a published schedule is a programme risk regardless of who supplies the replacement — so the useful question to put to any second source is not the price but the product lifecycle statement and the change notification process behind it.
What a documented cross-reference looks like on this family. The KR1253 is specified against the Molex system at component level: the housing against the 51146 series, the wafer against the 53779 / 53780 series, and the terminal against the 50641 series — with matching 1.25mm pitch, 125V rating, 1.0A per contact and the same AWG #28–32 wire range. Component-level mapping is what a second-source qualification needs, and it is also where the mapping stops: KONNRA does not document an equivalent for the 55063 (1.03mm) or 55178 headers, nor for the 50753 (#30–32) terminal series. If your design uses those, raise them explicitly rather than assuming the family mapping covers them.
Ten things to verify before you cross-reference
These are the places this pair of documents disagree, in the order they tend to cause damage. Each figure is attributable to a named document on both sides.
1. The operating temperature range — the largest single difference. Molex rates the family −40°C to +85°C (PS-51146-010 §3, repeated in part data for the housing and the 53780 header). KONNRA documents −40°C to +105°C. That is 20°C at the top end, and the heat-resistance tests differ too: Molex runs 85±2°C for 96 hours, KONNRA 105±2°C for 96 hours. If your thermal analysis assumes 105°C because the replacement is specified that way, verify it against your own temperature-rise testing rather than reading it off a datasheet.
2. The dielectric withstanding voltage — and KONNRA's own documents disagree with each other. Molex specifies 250V AC (RMS) for 1 minute with a no-breakdown criterion. KONNRA's product-page table and housing drawing state 250V AC/minute — so the product page agrees with the original. But KONNRA's specification PDF §5.3 and the terminal drawing state 500V AC for 1 minute, double that. Do not quote 500V without resolving which document governs. Note that the rated voltage — 125V — is identical on both sides, so this is purely a test-claim difference.
3. Contact resistance — the KONNRA product page is an outlier against its own specification. The product page's general specification table says 30mΩ Max. KONNRA's specification §5.1 specifies 20mΩ Max by dry circuit, and all three of its drawings show 20mΩ Max, as do its wafer, housing and terminal component pages. Molex specifies 20mΩ max initially. The product page is the outlier on its own side; 20mΩ is the figure to work from, and it matches the original.
4. The insulation window does not fully overlap at AWG #32. Molex specifies a gauge-specific window — φ0.9mm maximum at #28 and #30, but only φ0.55mm maximum at #32. KONNRA documents a single window of 0.6 to 0.9mm, with no gauge split, against a wire range that includes AWG #32. A wire that satisfies KONNRA's 0.6mm lower bound is outside Molex's φ0.55mm maximum for #32, so a #32 design cannot be validated against both documents at once. KONNRA does publish a lower bound as well as an upper bound — check both ends against your actual cable.
5. Durability is 30 cycles on one Molex document and 50 on another. PS-51146-010 §4-3-1 specifies 30 mating cycles (below 10 cycles/minute, after which contact resistance must stay within 40mΩ); molex.com part data for the 53780 states 50. KONNRA specifies 30 cycles with the same 40mΩ criterion — so 30 is the figure both sides substantiate, and the 50-cycle catalogue value needs confirming if your service model depends on it.
6. Circuit counts run wider on the KONNRA side — and KONNRA's own drawings disagree with each other. Molex's 53780 part list enumerates 2, 3, 4, 5, 6, 7, 8, 9, 10, 14, 15 and 20 circuits. The KONNRA housing drawing states 2~15, 20, 30; the product page states 2–30; the wafer drawing states "Circuits: 2~20,30", which omits 15 and does not match the housing drawing. Treat 30 positions as beyond the published Molex header range and confirm both the exact count and which drawing governs.
7. Crimp pull-out force is specified higher on the KONNRA side. Molex's minimums are 9.8N (1.0 kgf) at #28, 4.9N (0.5 kgf) at #30 and 2.9N (0.3 kgf) at #32. KONNRA's specification §6.5 lists 1.36 kgf, 0.9 kgf and 0.7 kgf for the same gauges — higher across the board. Not automatically a problem, but a different test claim on a different crimp barrel, and it should be confirmed as applying to the wire you actually use.
8. Terminal and pin retention are also claimed higher by KONNRA. Molex specifies crimp terminal retention at 4.9N (0.5 kgf) minimum and header terminal retention at 2.0N (0.2 kgf) minimum. KONNRA specifies terminal/housing retention 0.7 kgf (6.86N) minimum and pin retention 0.3 kgf (2.94N) minimum. Same direction as item 7, on its own test method.
9. Insertion and withdrawal force largely agree — with one anomalous row. Molex specifies 2.1N (0.22 kgf) per circuit maximum insertion and 0.2N (0.02 kgf) per circuit minimum withdrawal. KONNRA's table lines up exactly at the low end: 2 circuits → 0.44 kgf max insertion and 0.04 kgf min withdrawal, which is 0.22 and 0.02 kgf per circuit. But the KONNRA 15-position row shows withdrawal force of 2.30 kgf, against a pattern predicting 0.30 kgf and a 16-position value of 0.32 kgf. That reads as a typographical error in the published table — confirm it rather than quoting it.
10. Plating thickness, wire construction and gas testing are documented by Molex and not by KONNRA. Molex specifies gold thickness on the mating interface (0.200µm min on the 53780 header, 0.203µm min on terminal 506418041) and 3.000µm min termination plating on the header. Molex also states the applicable wire is in principle tin-plated copper stranded wire, with other constructions requiring consultation and evaluation, and specifies SO₂ gas (50±5ppm, 40±2°C, 24 hours) and NH₃ gas (40 minutes over a 28% solution) exposure tests. KONNRA's specification lists no plating thickness, no wire construction and no gas tests. If your qualification includes any of the three, they are open items.
Two further test-severity differences worth lining up, because they decide whether a qualification carries over:
- Humidity — Molex: 60±2°C, 90–95% RH for 96 hours, with insulation resistance allowed to fall to 10MΩ minimum. KONNRA: 40±2°C, 90–95% RH for 96 hours, with 100MΩ minimum.
- Salt spray — Molex: 48±4 hours at 35±2°C with 5±1% NaCl. KONNRA: 24 hours at the same concentration and temperature.
- Thermal cycling — Molex: −55°C to +105°C. KONNRA: thermal shock −40°C to +105°C.
None of these is a defect. They are different severities, and they are the reason a qualification sometimes has to be repeated rather than carried over.

Design cautions from Molex's own specification
Molex publishes thirty-seven numbered notes in PS-51146-010 — an unusually long list. They are not marketing; they are the failure modes the product is known to have, and they are the most useful part of the document for anyone designing this connector in or out. KONNRA does not publish an equivalent list, and its own overview adds two design features worth noting in the same breath: an anti-flux penetration design described as fully shielded, and a construction that prevents the connector from being inserted backwards.
On electrical and mechanical limits:
- Do not mate or unmate under load. Molex states the product "is not designed for the mating and unmating of the connectors to be performed under the condition of an active electrical circuit", and that doing so "may cause a spark and product defect". If your service procedure disconnects this connector live, that procedure needs changing.
- Respect the per-circuit rating, and the sum. The sum of current across several circuits must not exceed the maximum allowable current — the per-circuit figure is not the whole answer.
- No continuous pulling or stress force when mated — it damages the contact area, the crimp and the terminal lock. Leave enough wire length and slack that no tension reaches the connector.
- Never carry the board by the harness while mated, and do not apply pressure in the pitch, span or rotational direction after mating — Molex states this may damage the connectors and crack the solder joints.
- Avoid sympathetic vibration between the wires and the PCB: fix both to the chassis so sustained relative movement cannot wear the contact area.
On assembly and process:
- Withdraw slowly, axially and straightly. Hold the wires together lightly, put a finger on the lock, push the release bar with the flat of the finger until the lock is completely released, then withdraw. Angled or rough withdrawal "might cause damage to connector".
- Mate along the mating axis — or under 10° if diagonal mating is unavoidable, then push straight in until fully mated.
- Use a new housing after extracting a terminal. Extracting a crimp terminal with a jig can deform the housing lance and "reduce the terminal retention force enormously" after re-insertion.
- Solder every terminal tail and every fitting nail. Leaving any soldering area open risks terminal drop-out, pin-to-pin short circuits, terminal buckling, or the connector coming off the PCB. On this family the solder interface is the retention system, so this is a reliability requirement.
- Do not wash the connectors — Molex states any washing process may damage the product's function.
- Expect coplanarity to be a pre-mount specification. Molex requires PCB warpage of 0.02mm maximum across the connector, and states coplanarity is assured only before mounting — there is no guarantee after mounting or after reflow.
- Air reflow is assumed; N₂ reflow needs separate evaluation, because solder wicking can occur. Hand-soldering repair is specified at 370–400°C for a maximum of 5 seconds, with no excessive pressure and no excess solder or flux.
- Confirm the board material. Molex's general performance verification was carried out on a glass-epoxy board, and it requires consulting before mounting on a flexible or other special PCB, and before designing to a modified board pattern.
The reflow profiles are close but not identical, and this is the one process parameter worth putting side by side. Molex specifies a peak of 250 +5/−0°C, 20–40 seconds at 230°C minimum, and 90–120 seconds of preheat at 150–200°C, with a reflow count of 1 maximum. KONNRA specifies 5–10 seconds at a 255±5°C peak, with the same 20–40 seconds at 230°C minimum and the same 90–120 seconds of preheat at 150–200°C. The preheat and time-above-liquidus windows match; the peak temperatures differ by roughly 5°C. Both manufacturers tell you to verify the profile on your own equipment and boards — and on this family that instruction is not boilerplate, because the whole point of the product is a thin moulding sitting on a thin board.

Where it fits, and what it is not for
Molex's design intent is specific: an ultra-low-profile, fully shrouded wire-to-board system for flat panel displays — KONNRA describes the KR1253 for flat panel LCDs such as entertainment displays, consumer electronics, personal computers and mobile devices that can be as small as 10 centimetres or less, with a documented minimum height of 1.90mm.
Where it fits:
- Flat panel displays and display modules — the design intent, for boards with almost no vertical clearance
- Compact consumer electronics and handhelds — 1.25mm pitch in a fully shrouded body, at whatever profile the chosen plug assembly provides
- Boards assembled on an SMT line — SMT headers, embossed tape on reel, solder tabs, shrouded construction for handling
- Designs needing more than 50V of headroom — 125V, against 50V for JST's GH at the same 1.25mm pitch
- Signal and low-power harnesses in vibration environments — tested to 490 m/s² (50G) shock and a 1.5mm P-P sweep, with friction-lock retention and shell hooks
- Applications where the harness crosses an enclosure wall — the harness passes through as a wire bundle; the connector stays on the PCB
What it is not for. At 1.0A per contact it is a signal and low-power interface, not a power connector. It is not a panel-mount or bulkhead connector — Molex records Panel Mount: No. It is explicitly not for hot-mating. And with a 30-cycle durability specification on both sides, it is not a connector to design a repeated-service cycle around.
Two harness notes that come straight from Molex's specification. First, the connector must not carry the harness load — on a display board where the cable routes through a moving hinge, that requirement shapes the whole harness drawing. Second, crimp tooling is a per-terminal document, not a connector document: Molex publishes the crimp details in CS-50641 and CS-50753, named in the connector specification but not reproduced in it, while KONNRA publishes its crimp dimensions inside PS-KR1253-01 §6.5 — including height windows of 0.53–0.60mm at #28, 0.48–0.55mm at #30 and 0.43–0.50mm at #32, a crimp width of 0.85±0.1mm, insulation crimp heights of 1.15 / 1.10 / 0.85mm maximum, and a strip length of 1.2–1.5mm. If your harness house has to move between the two, expect to qualify the crimp again.
Engineer's pre-release checklist
Run this before releasing a drawing for a PanelMate-family connector.
- Series number confirmed, not inferred. At 1.25mm, PanelMate (51146) and PicoBlade (51021) are different systems with different footprints. They do not mate.
- Panel-mount requirement settled. Molex records Panel Mount: No for this family. If the connector has to fasten to the enclosure, stop and re-specify the family.
- Header height matched to the original — 1.03mm, 1.3mm or 1.85mm by plug assembly, against a KONNRA-documented 1.90mm minimum height.
- Circuit count inside both published ranges — Molex's 53780 part list to 20; KONNRA to 30. Counts above 20 need explicit confirmation.
- Wire gauge and insulation diameter inside both windows — Molex φ0.9mm max at #28/#30 and φ0.55mm max at #32; KONNRA 0.6–0.9mm. At AWG #32 the windows do not fully overlap.
- Operating temperature aligned to the original — +85°C per Molex, +105°C per KONNRA. If the design assumes 105°C, substantiate it.
- Dielectric withstanding voltage resolved — 250V AC (RMS)/1 min per Molex and per KONNRA's product page and housing drawing; 500V AC/1 min per KONNRA's specification PDF and terminal drawing. Quote one, and know which.
- Contact resistance taken from the right document — 20mΩ max on both sides; the 30mΩ Max on the KONNRA product page is that page's own outlier.
- Plating thickness specified — Molex publishes 0.200µm / 0.203µm minimum on the mating interface; KONNRA publishes "gold flash" with no thickness.
- Sum of current across circuits checked against the maximum allowable, not just the per-circuit figure.
- Crimp specification qualified — Molex crimp details live in CS-50641 / CS-50753; KONNRA publishes height and width windows in §6.5. Treat KONNRA's published 15-position withdrawal-force row as unverified.
- Service procedure checked for hot-mating — both sides exclude it, and Molex states unmating under an active circuit may cause a spark and product defect.
- Terminal extraction procedure written — fit a new housing after extracting a terminal, because the lance deforms and retention drops enormously.
- Mating axis alignment in the build instruction — straight along the axis, or under 10° if diagonal mating is unavoidable.
- Withdrawal instruction written — hold the wires together, release the lock completely, withdraw slowly and axially.
- Wire construction confirmed as tin-plated copper stranded, or raised for evaluation if it is not.
- All solder tails and fitting nails soldered, per Molex's requirement. On a board whose only retention is the solder interface, this is a reliability requirement rather than a process preference.
- Harness strain relief designed so no continuous load reaches the mated connector, and the harness never used to carry the board.
- Reflow profile agreed against both documents — peak 250 +5/−0°C (Molex) versus 255±5°C (KONNRA), with the same preheat and time-above-liquidus windows. Air reflow assumed; N₂ reflow needs separate evaluation.
Getting a cross-reference check
Most PanelMate enquiries stall on the same thing: the buyer is not sure what information the supplier needs, so the enquiry never gets sent. The list is short.
- The original part number, if you have it — a housing such as
51146-**00, a terminal such as50641-8***or50753-8***, or a plug assembly such as53780-**19 - Circuit count — Molex's 53780 part list runs to 20; KONNRA documents 2–30, so a count above 20 needs raising explicitly
- The header height you need — 1.03mm, 1.3mm or 1.85mm on the Molex side, against a KONNRA-documented 1.90mm minimum. The height is the first thing to reconcile
- Wire gauge and insulation outside diameter — and specifically whether you are on AWG #32, where the two windows do not fully overlap
- Plating finish required — gold flash or a specified thickness. Molex publishes 0.200µm / 0.203µm minimum on the mating interface; KONNRA documents the finish but not the thickness
- The terminal series your approved part number names, if it names one — 50641 for AWG #28–30 or 50753 for AWG #30–32; KONNRA documents a single terminal pair across AWG #28–32
- Your required operating temperature — Molex +85°C, KONNRA +105°C. This is the largest single documented difference
- Your load current and circuit count, so the per-circuit rating and the sum-of-current note can be settled rather than assumed
- Whether the application requires the connector to fix to an enclosure panel — if it does, neither part number is the right one
- Application and annual volume, plus a drawing or photo if the part number is unreadable or the design has been reverse-engineered
When you send a part number, four things get confirmed against Molex's own documentation: the terminal that matches your wire gauge and insulation diameter, the gold thickness you need, the header height and mounting type, and whether your design needs an option beyond the published range so it can be quoted honestly rather than assumed.
And one thing worth adding to that enquiry on this family specifically: the original is on a published withdrawal schedule. Ask any second source for a product lifecycle statement and a change notification process — the answer you want is not a price, it is a commitment that outlives the part you are replacing.
Connector lead time is typically 2–3 weeks, wiring harness lead time typically 3–4 weeks, and complete connector set samples can be delivered within 45 days, with key materials prestocked. Where crimp pull-out force or retention needs validating before commitment — both specified in detail on this series — sample harnesses can be supplied from the same process used in production.
Full technical write-up: Molex PanelMate Connector Complete Guide
Disclosure: I work with KONNRA, which manufactures the KR1253 cross-reference to the Molex PanelMate 1.25mm system. The Molex figures in this article are taken from Molex's published product specification PS-51146-010 and molex.com part data for the 51146 housing, the 53780 header and terminal 506418041; the KONNRA figures are from KONNRA's published KR1253 product documentation and specification PS-KR1253-01. Where the two sources disagree — or where one source contradicts itself — I have flagged the difference rather than averaged it. KONNRA's published 15-position withdrawal-force row reads as a typographical error and is marked unverified rather than quoted, and parameters stated by neither source are marked as not documented rather than estimated.
https://konnra.com/molex-panelmate-mx1-25-connector-complete-guide/
Dongguan Konnra Electronics Co., Ltd